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DFG8340

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...

DFG8540

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...

DFG8560

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...

DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...

DFP8160

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

DFP8140

Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...

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DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...

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DAS8920

Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface ...

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DAS8930

Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

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DFS8910

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

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DFS8960

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

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DDS2010

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

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DDS2300

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

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DWR1720

Deionized Water Recycling Unit A super-compact deionized water recycling unit for advanced environmental performance • Integrates deionized water ...

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UVB-608i for up to 8"

Black-light type UVB-608i UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for exceptional cost-performance value.

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VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...

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UVC-408 for 8”

High- pressure Mercury lamp models which have perfect UV curing performances is 200mm (8”) manual and 300mm (12”) manual system.

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EX-300

EX Series Model: EX-300 for Gr-12 The EX series is an adopted motor drive for expansion stage operation. Expansion stroke and expansion speed can be controlled numerically. And film auto-cut function is equipped ...

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Grip Ring

A reinforced plastic double grip rings are consist of inner and outer rings.